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            India’s chip push gathers pace: 25 SEMICON deals target gases, chemicals, packaging and power electronics

            Tuesday, September 22, 2026 - 05:48:58
            • 6 Minute(s) Read
            India’s chip push gathers pace: 25 SEMICON deals target gases, chemicals, packaging and power electronics
            Arya News - Nearly 12,000 visitors attended the opening day of the New Delhi event, showcasing has more than 600 exhibitors – including international participants from Japan, Singapore, South Korea, and Europe joining India’s semiconductor outreach.

            NEW DELHI – India’s semiconductor push widened into critical materials, advanced packaging, logistics and power electronics on the second day of SEMICON India 2026, with 25 collaborations announced across the chip value chain.
            The agreements include moves to produce high-purity gases and chemicals locally, develop semiconductor components for renewable energy and AI data centres, expand advanced packaging capabilities and strengthen the specialised workforce needed by the industry.
            Union Electronics and Information Technology Minister Ashwini Vaishnaw said the event was drawing growing global interest in semiconductor activity in India. Industry leaders, he said, had also indicated willingness to increase investment based on their ability to execute projects.
            Nearly 12,000 people visited SEMICON India on its opening day, according to the government. The event has more than 600 exhibitors, including around 300 international exhibitors.
            Tata Electronics targets critical chipmaking supplies
            Several of the Day 2 partnerships centred on reducing dependence on imported materials and building domestic manufacturing capabilities.
            Tata Electronics tied up with INOX Air Products for high-purity gases used in semiconductor manufacturing. Its partnership with Sumitomo Chemical is aimed at local production of high-purity wet chemicals and advanced materials used in front-end manufacturing.
            Another Tata Electronics agreement, with Kelington Engineering, covers gas distribution systems, high-purity piping and process-tool hook-up. It also includes training for local partners.
            Tata Electronics and Japan’s Enomoto will work on advanced semiconductor packaging, including joint research and development and localisation of lead-frame manufacturing.
            The company also entered a strategic partnership with L&T Semiconductor Technologies to explore manufacturing L&T semiconductor products at Tata’s fab and OSAT facilities. Consumer-grade camera modules are expected to be the starting point.
            L&T turns to chips for solar, AI data centres and smart meters
            L&T Semiconductor Technologies announced a clutch of partnerships focused on power electronics.
            It will work with Virtual Forest on solutions for air-conditioning and solar-powered systems, while its collaboration with Newen Systems involves Silicon Carbide power modules for renewable energy systems and AI data centres.
            L&T Semiconductor Technologies and Fimer India will develop Insulated Gate Bipolar Transistors for renewable energy systems.
            A separate partnership with Capital Power Systems will work on IoT modules for smart meters, beginning with an indigenous 4G communication module.
            MeitY, the Ministry of Power and POWERGRID also announced a collaboration to support indigenous Silicon Carbide power modules for Voltage Source Converter-based HVDC transmission systems. The technology is to be piloted at POWERGRID’s 1,000 MW Pusauli project in Bihar.
            India unveils indigenous ISC VegaSOM
            One of the technology announcements came from IndieSemiC and C-DAC with the launch of the ISC-VEGA-SOM, described by the government as India’s first indigenous System-on-Module.
            The module combines C-DAC’s VEGA-Thejas32 processor with IndieSemiC’s LoRa RF module. It was developed under C-DAC’s Industry Support Centre initiative.
            The government said the product showed Indian semiconductor design companies moving beyond chip development towards products entering end-use applications.
            Kaynes Semicon and IndieSemiC also announced an OSAT collaboration covering qualification, assembly and testing of advanced packages, including QFN and BGA, as well as customised System-in-Package development.
            Kaynes Semicon, Microchip Technology and GridCrest Technologies will separately explore an end-to-end Indian pathway for energy-metering SoCs.
            Nippon Express brought in for semiconductor logistics
            Supply-chain infrastructure was another focus of the announcements.
            The India Semiconductor Mission signed an MoU with Nippon Express Holdings covering semiconductor logistics. Vaishnaw said the Japanese company would bring expertise in logistics, warehousing, customs and related requirements.
            C-MET Pune and Hindalco Industries also signed an MoU aimed at scaling critical raw materials used by the semiconductor industry.
            Vaishnaw said Indian semiconductor businesses would have to compete internationally on both cost and quality.
            Manufacturability, product life cycle and power consumption would also have to be factored into products, he said.
            New partnerships target India’s semiconductor talent gap
            A series of agreements focused on training and semiconductor design education.
            SEMI and the India Deep Tech Alliance announced a collaboration to develop the India Semiconductor Academy as an industry-led skilling platform. Partners listed for the initiative include Cadence, CG Semi, Dixon Technologies, Micron Technology, Synopsys, 3D Glass Solutions, UC San Diego and IIT Kanpur.
            NIELIT announced partnerships with Siemens EDA, Tata Electronics, Singapore Polytechnic International, IESA and SEMI University covering design education, training, certification and workforce development.
            NIELIT and SCL also launched an indigenous 0.8-micron open-source Process Design Kit on the NIELIT eChipHub platform for students and innovators.
            Separately, Silvaco and C-DAC’s ChipIN Centre announced access to advanced TCAD tools for startups and MSMEs onboarded under the Design Linked Incentive programme, as well as C-DAC research and training initiatives.
            The India Deep Tech Alliance reported investments worth $263 million across 56 Indian deep-tech companies.
            Vaishnaw flags water, cooling needs as chip ecosystem expands
            Vaishnaw also put sustainability on the agenda as semiconductor manufacturing and data-centre infrastructure expand.
            He pointed to extensive water recycling in semiconductor fabs and closed-loop cooling systems in data centres as technologies that could reduce resource use.
            International participation was also substantial. More than 30 companies each from Japan and Singapore participated through their respective pavilions, while South Korea and European countries including Belgium, the Netherlands and Sweden were represented.
            SEMICON India 2026 runs from September 17 to 19 at Yashobhoomi in New Delhi. The organisers say the event is expected to draw around 50,000 visitors from 52 countries and features more than 400 executives and over 150 speakers.

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